Vacuum Solutions for Chemical Vapor Deposition (CVD)
Gases containing a metal or insulating material are sprayed on the heated wafer surface, react on the surface forming a thin metal or insulating layer of solid material. Maintaining extreme uniformity across the wafer is the main challenge for CVD processing.
Various CVD technologies like PE-CVD (plasma enhanced CVD), LP-CVD (low pressure CVD), HDP-CVD (high density plasma CVD), ALD (atomic layer CVD) etc. are applied to deposit layers of dielectric materials. Most processes require vacuum in the range of 10-3 - 10-7 mbar. Since the processes are using harsh chemistry, process vacuum pumps have to be designed for corrosive service to perform successfully in that type of environment and to secure high tool uptime.
Reliability and uptime are attributes which are perfectly accommodated with the various products from Pfeiffer Vacuum.
Main fields of application for our products are:
- PE-CVD
- LP-CVD
- HDP-CVD
- Atomic layer CVD
- Load/Lock
Our products are used for:
Vacuum measurement
Quantitative analysis
Leak detection
Page functions
-
Recommend this page!
-
Social Networks:
Contact
Address
Headquarters postal address
Pfeiffer Vacuum GmbH
Berliner Strasse 43
35614 Asslar
Germany
P.O. Box
Pfeiffer Vacuum GmbH
Berliner Strasse 43
35614 Asslar
Germany
T +49 6441 802-0
F +49 6441 802-1202