Vacuum Solutions for Etching
The etching process is one of the most common processes to remove materials from the wafer surface. Various etching techniques like dry etching, plasma etching or reactive ion etching (RIE) are used.
Most processes require vacuum in the range of 10-2 - 10-4 mbar. Since the processes are using very harsh chemistry, process vacuum pumps have to be designed to withstand that corrosive environment and to secure high tool uptime. Since most of the etchants are condensable vapors, attention needs to be paid to the downstream side of the tool to avoid condensation and built up of material in the forelines. Waste management systems have to be used to clean the exhausted gases and to comply with the environmental requirements.
Main fields of application for our products are:
- Dry Etch
- Plasma Etch
- Reactive Ion Etch
- Load/Lock
Our products are used for:
Vacuum measurement
Quantitative analysis
Leak detection
Page functions
-
Recommend this page!
-
Social Networks:
Contact
Address
Headquarters postal address
Pfeiffer Vacuum GmbH
Berliner Strasse 43
35614 Asslar
Germany
P.O. Box
Pfeiffer Vacuum GmbH
Berliner Strasse 43
35614 Asslar
Germany
T +49 6441 802-0
F +49 6441 802-1202