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Vacuum Solutions for Etching

The etching process is one of the most common processes to remove materials from the wafer surface. Various etching techniques like dry etching, plasma etching or reactive ion etching (RIE) are used.

Most processes require vacuum in the range of 10-2 - 10-4 mbar. Since the processes are using very harsh chemistry, process vacuum pumps have to be designed to withstand that corrosive environment and to secure high tool uptime. Since most of the etchants are condensable vapors, attention needs to be paid to the downstream side of the tool to avoid condensation and built up of material in the forelines. Waste management systems have to be used to clean the exhausted gases and to comply with the environmental requirements.

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