Vacuum Solutions for Physical Vapor Deposition (PVD)
PVD is mainly used to generate barrier and seed layers for copper based devices, depositing mainstream materials like Tantalumnitride, Copper, Cobalt, Titanium Titaniumnitride, Aluminum and its alloys. PVD processes require high vacuum in the range of 10-5 - 10-8 mbar.
Since the processes is fairly clean, mostly standard vacuum pumps can be utilized. High vacuum is also required in transfer chambers, wafer clean and cool chambers as well as for loading and unloading of the wafers (L/L). The architecture of the PVD tools requires several high vacuum pumps from 70 - 1,500 l/s to perform the various process steps.
Main fields of application for our products are:
- Sputter
- Load/Lock
Our products are used for:
Vacuum measurement
Leak detection
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Headquarters postal address
Pfeiffer Vacuum GmbH
Berliner Strasse 43
35614 Asslar
Germany
P.O. Box
Pfeiffer Vacuum GmbH
Berliner Strasse 43
35614 Asslar
Germany
T +49 6441 802-0
F +49 6441 802-1202