Pfeiffer Vacuum

Vacuum Solutions for Physical Vapor Deposition (PVD)

PVD is mainly used to generate barrier and seed layers for copper based devices, depositing mainstream materials like Tantalumnitride, Copper, Cobalt, Titanium Titaniumnitride, Aluminum and its alloys. PVD processes require high vacuum in the range of 10-5 - 10-8 mbar.

Since the processes is fairly clean, mostly standard vacuum pumps can be utilized. High vacuum is also required in transfer chambers, wafer clean and cool chambers as well as for loading and unloading of the wafers (L/L). The architecture of the PVD tools requires several high vacuum pumps from 70 - 1,500 l/s to perform the various process steps.

Main fields of application for our products are:

Our products are used for:

Page functions
  • How would you rate this page?


  • Recommend this page!


  • Social Networks:


Contact options

Our points of contact are available to you at any time:

Display contact options


You can use our contact form to send your request or concern directly to us.

Contact Form

Headquarters postal address

Pfeiffer Vacuum GmbH
Berliner Strasse 43
35614 Asslar

P.O. Box

Pfeiffer Vacuum GmbH
Postfach 1280
35608 Asslar

T +49 6441 802-0
F +49 6441 802-1202

Copyright © 2015 Pfeiffer Vacuum GmbH