High performance
Advanced screw design, excellent running qualities, integrated vacuum booster, perfectly suited for chemical vapor deposition, rapid thermal processing or atomic layer deposition
Efficient
Low cost of ownership, minimal maintenance, long service intervals, high uptime, efficient indirect water cooling, high hydrogen throughput
Compact
Fit-in-place design, directly mounted canned motor, backing pump and vacuum booster combined on a compact base frame
Technical specifications
Markets & applications
Flat panel display production
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Load Lock Chambers
Semiconductor applications
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Metal & high K etch
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LPCVD / Diffusion
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High flow applications
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ALD
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PECVD
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Si Poly etch
Solar power industry
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Cell Manufacturing
Accessories
- Optional powder process version available (only for DS 3010 G and DS 3161 C)
- Optional tantal coating