PVD (Physical Vapor Deposition)

Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films. This technology is used in semiconductor manufacturing to create ultra-thin cap layers, metal gate films in high-k/metal, gates for advanced transistors, and to form ultra-thin barrier materials and seed layers for interconnects.

Application requirements

  • Low cost of ownership thru low power consumption and long maintenance intervals
  • Low base pressure

How does it work?
The most common PVD process used is sputtering technology: The target material is bombarded by the inert gas (mostly Argon) ions generated in the plasma. Then the target material is ejected from the surface and deposits on substrate.

Vacuum requirements
Such process operates at high vacuum below 10-3 to 10-7 Torr range, requiring the use of dry roughing pumps, turbopumps as well as cryopumps. As there is no chemical reaction, this process generates no by-products and is therefore a clean application for vacuum pumps.

Product portfolio
Pfeiffer Vacuum supplies the A4H Series, a full range of dry pumps and magnetically levitated turbopumps dedicated to PVD applications. Our ATHM turbopumps are qualified on many PVD tools at major OEMs.

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