Etch & Clean
Manufacturing of a semiconductor component is a very complex process, involving many steps under vacuum. Dry etch process is one of them and consists of selectively removing a material on the wafer. This material can either be a conductor material, shaping the structure of the semiconductor component, or a dielectric material, insulating the conducting parts of the component. Strip & Clean processes are also used to remove selective materials from wafer surface, such as photoresist film and residues that could impact the device performance. Each technology requires a different level of vacuum. We provide high vacuum turbo pumps and primary dry pumps solutions dedicated to your Etch & Clean applications and designed for the lowest cost of ownership and highest process lifetime.