Manufacturing of a semiconductor component is a very complex process. Photolithography process is one of them and consists of defining and transferring patterns in each layer of the device. As chip node dimensions continuously shrink, traditional photolithography using Ultra Violet (UV) light has reached its limits. A new lithography process using Extreme Ultra Violet light (EUV) under vacuum has emerged. We provide high vacuum turbopumps and primary dry pumps solutions dedicated to EUV application, supporting advanced chip scaling below 10 nm node.